A-Series APU for Notebook Description

Tech/Package
32nm / FS1 722-pin lidless micro PGA, 35x35 mm, 1.2192 mm pitch

TDP Configs
35W and 45W configurations
Processor Core
“Stars” 32nm HKMG process core (up to 4 cores), 128 KB L1 Cache (64 KB Instruction, 64 KB Data) 1 MB L2/Core, 128-bit FPUs

Memory
Up to DDR3 1600 @ 1.5V, DDR3L 1333 @ 1.35V

Graphics Core
Up to 400 Radeon™ Cores, DirectX® 11 capable, UVD3 Displays -Digital Display I/F DP0: Display Port, HDMI, DVI -Digital Display I/F DP1: Display Port, HDMI, DVI -LVDS and VGA from Travis translator

Power Management
• Multiple low-power states
• 32-nm process for decreased power consumption
• AMD AllDayTM power
• System Management Mode (SMM)
• ACPI-compliant, including support for processor performance states (P-states), processor power states (C-states), and sleep states including S0, S3, S4, and S5
• Per core power gating (CC6)
• PCIe® core power gating
• PCIe speed power policy
• GPU power gating of Radeon™ Cores and video decode (UVD3)
• AMD Turbo Core technology

AMD A60M/AMD A70M FCH

Integrated DAC supporting VGA.

Tech/Package
65nm / FC BGA, 605-Ball, 23x23mm, .8mm pitch

TDP Configs
2.7W to 4.7W for typical configurations

UMI
x4 Gen 1 + DP

SATA
6 Ports, 6 Gbps

RAID
0,1

USB
A70M: 4 USB 3.0 Ports, 10 USB 2.0 Ports, 2 USB 1.1 Internal Ports
A60M: 14 USB 2.0 Ports, 2 USB 1.1 Internal Ports

PCIe GPPs
4x1 Gen2

HWM
Incorporates Fan Control, Voltage Level Sensing

CIR
CIR Receiver

Clock Gen
Integrated

Motherboard

Power Rails
SVID for VDDCR_CPU & VDDR_NB, fixed voltage for other rails

Software/Firmware
Software Drivers: Windows 7, Windows Vista, Linux

Firmware
SBIOS, VBIOS, Diagnostics, Utilities